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Global Encapsulants Market Size By Curing Type (Room Temperature, UV, Heat Temperature), By Chemistry (Epoxy, Urethane, Silicone), End-Use Industry (Consumer Electronics, Medical, Energy And Power, Transportation), By Geographic Scope And Forecast


Published on: 2024-08-01 | No of Pages : 320 | Industry : latest updates trending Report

Publisher : MIR | Format : PDF&Excel

Global Encapsulants Market Size By Curing Type (Room Temperature, UV, Heat Temperature), By Chemistry (Epoxy, Urethane, Silicone), End-Use Industry (Consumer Electronics, Medical, Energy And Power, Transportation), By Geographic Scope And Forecast

Encapsulants Market Size And Forecast

Encapsulants Market size was valued at USD 4.02 Billion in 2023 and is projected to reach USD 7.25 Billion by 2031, growing at a CAGR of 8.42% from 2024 to 2031.

  • Encapsulants refer to materials used to surround and protect electronic components or assemblies from environmental factors such as moisture, dust, chemicals, and mechanical shock. These materials are typically in liquid form before application and then harden to form a solid protective layer.
  • Encapsulants are extensively used in electronics manufacturing to protect components like integrated circuits (ICs), printed circuit boards (PCBs), sensors, and other electronic assemblies from environmental hazards that could affect their performance and reliability.
  • In the solar PV sector, encapsulants are used to protect solar cells and modules from moisture and mechanical stress, ensuring longevity and performance efficiency over the operational lifetime.
  • Encapsulants are used in LED lighting applications to protect the LED chips from moisture, dust, and mechanical stress, thereby enhancing durability and maintaining optical performance.
  • Future developments in encapsulant materials will focus on enhancing properties such as thermal conductivity, flexibility, UV stability, and ease of application to meet evolving technological demands.

Global Encapsulants Market Dynamics

The key market dynamics that are shaping the Encapsulants Market include

Key Market Drivers

  • Innovations in Material and ProcessOngoing innovations in encapsulant materials and manufacturing processes are enhancing product performance and reliability, which is a significant driver for market demand.
  • Solar PV Panel DeploymentThe rising deployment of solar photovoltaic (PV) panels necessitates encapsulants for protection against environmental factors, contributing to market growth.
  • Electronics DemandThe increasing demand for electronics and electrical appliances globally is expected to fuel market growth.
  • Disposable Income and Smart DevicesThe rising disposable income, along with the increasing adoption of smart devices like televisions, smartphones, and wearable devices, are key factors fueling the growth of the global Encapsulants Market.
  • Manufacturing Sector GrowthThe growth of the manufacturing sector and the availability of cheap labor are key factors driving the growth of the encapsulant market in the Asia Pacific region.

Key Challenges

  • Economic and Currency FluctuationsFluctuations in economic conditions and currency exchange rates may affect market dynamics and investment decisions, leading to uncertainty for stakeholders.
  • Material and Process ComplexityThe complexity of encapsulant materials and manufacturing processes may pose challenges in product development and quality control.
  • Raw Material Price VolatilityThe volatility of commodity prices, especially since the raw materials for encapsulants come from petroleum-based resins, could restrict the global market for encapsulants.

Key Trends

  • Surge in Industry DemandThe market is experiencing a surge in demand driven by various industries such as electronics, automotive, and renewable energy sectors.
  • Performance and ReliabilityAdvancements in encapsulant materials and manufacturing processes are leading to enhanced performance and reliability, meeting the evolving needs of end-users.
  • Miniaturization in DevicesThe increasing complexity and functionality of electronic devices and the trend of miniaturization are among the major reasons for the growing importance of encapsulants in the semiconductor & electronics industry.

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Global Encapsulants Market Regional Analysis

Here is a more detailed regional analysis of the global Encapsulants Market

 Asia-Pacific

  • Asia-Pacific is currently the largest market for encapsulants, driven by robust manufacturing sectors in countries like China, Japan, and South Korea.
  • South Korea, in particular, leads due to its strong presence in the electronics manufacturing industry, where encapsulants are extensively used in producing various electronic devices.
  • The region’s dominance is attributed to the high demand from the electrical and electronics industry, which uses encapsulants for insulation purposes in electronic devices.

North America

  • North America is home to some of the world’s leading electronics manufacturers, driving significant demand for encapsulants to protect and enhance the performance of electronic components and devices. These manufacturers require high-performance encapsulants that meet stringent quality standards to ensure reliability and durability of their products.
  • The region has made substantial investments in renewable energy, particularly in solar photovoltaic (PV) installations. Encapsulants play a critical role in solar PV modules by protecting the sensitive solar cells from environmental factors such as moisture, UV radiation, and mechanical stress.
  • As North America continues to expand its solar energy capacity, the demand for encapsulants is expected to grow correspondingly.

Global Encapsulants MarketSegmentation Analysis

The Global Encapsulants Market is Segmented on the basis of Curing Type, Chemistry, End-Use Industry, and Geography.

Encapsulants Market, By Curing Type

  • Room Temperature
  • UV
  • Heat Temperature

Based on Curing Type, the market is segmented into Room Temperature, UV, and Heat Temperature. According to curing type, the market for encapsulants is anticipated to develop at the greatest CAGR over the forecast period. Systems for curing at room temperature provide simple processing and excellent reliability. It has good electrical qualities and minimal stress. During curing, no byproducts are emitted. They can heal in confined spaces. Room temperature curing encapsulants cure at ambient temperatures without the need for additional heat or UV exposure. They are convenient and widely used in various industries.

Encapsulants Market, By Chemistry

  • Epoxy
  • Urethane
  • Silicone

Based on Chemistry, the market is segmented into Epoxy, Urethane, and Silicone. The market for encapsulants was dominated by the silicone category. Flexible, temperature-resistant, and offering great defense against moisture and the elements are all characteristics of silicone-based encapsulants. They are used in industries like consumer electronics, medical technology, and renewable energy. The silicone sector of the Encapsulants Market is being driven by both consumer demand for electronic devices and the commercialization of electric vehicles.

Typically, silicone is a softer, less dense material. Silicone utilization has increased as a result of recent advancements in material characteristics. The market for encapsulants’ second-largest share belonged to the epoxy category. The demand for epoxy encapsulants is rising as a result of the expansion of the worldwide semi-conductor market and the development of electronic devices based on contemporary technologies.

Encapsulants Market, By End-Use Industry

  • Consumer Electronics
  • Medical
  • Energy & Power
  • Transportation

Based on End-Use Industry, the market is segmented into Consumer Electronics, Medical, Energy & Power, and Transportation. Encapsulants’ main market has been consumer electronics. The demand for encapsulants in this business is primarily driven by the expansion of the semiconductor and electronics industries as well as the rising popularity of smart electronic devices.

The drive towards miniaturization and the rise in the variety of functions that electronic devices may perform have increased the number of parts and short-circuiting threats. These have made using encapsulants in electronic equipment necessary. The main producers of consumer electronics are China, Japan, and South Korea. The fact that India has the second-largest consumer base for the purchase of these consumer electronics is another crucial element.

Key Players

The “Global Encapsulants Market” study report will provide valuable insight with an emphasis on the global market including some of the major players of the industry are DOW CORNING CORPORATION, HB Fuller, Shin-Etsu Chemical Co., Ltd., Sumitomo Bakelite Co., Ltd., Henkel AG & KGaA Co., Resin Technical Systems, Sanyu Rec Co., Ltd., John C. Dolph, Master Bond Inc., ACC Silicones, Dymax Corporation, Kyocera Corporation, HITACHI CHEMICAL CO., LTD., Panasonic Corporation, EPIC RESINS, ELECTROLUBE, MATERIALS PROCESSING SYSTEMS, INC., THE 3M COMPANY, and BASF SE.

Our market analysis provides in-depth information on key players, including information on their financial statements, product portfolios, product benchmarking, and SWOT analyses. Along with market share research, important development strategies, recent advancements, and market ranking analysis of the aforementioned competitors globally are also included in the competitive landscape section.

Encapsulants Market Recent Developments

  • In September 2022, Sumitomo Bakelite Co., Ltd. builds a new plant to increase its production capacity for encapsulation semiconductor packaging materials.
  • In July 2022, Shin-Etsu Chemical Co., Ltd. and Industrial Technology Research Institute (ITRI) jointly developed an encapsulant material for Mini LED displays. This encapsulant material product is adaptable for use in various Mini LED displays developed by ITRI.

Report Scope

Report AttributesDetails
Study Period

2020-2031

Base Year

2023

Forecast Period

2024-2031

Historical Period

2020-2022

Unit

Value (USD Billion)

Key Companies Profiled

DOW CORNING CORPORATION, HB Fuller, Shin-Etsu Chemical Co., Ltd., Sumitomo Bakelite Co., Ltd., Henkel AG & KGaA Co., Resin Technical Systems, Sanyu Rec Co., Ltd.

Segments Covered

By Curing Type, By Chemistry, By End-Use Industry, and By Geography

Customization scope

Free report customization (equivalent to up to 4 analyst working days) with purchase. Addition or alteration to country, regional & segment scope.

Research Methodology of Market Research

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Reasons to Purchase this Report

• Qualitative and quantitative analysis of the market based on segmentation involving both economic as well as non-economic factors• Provision of market value (USD Billion) data for each segment and sub-segment• Indicates the region and segment that is expected to witness the fastest growth as well as to dominate the market• Analysis by geography highlighting the consumption of the product/service in the region as well as indicating the factors that are affecting the market within each region• Competitive landscape which incorporates the market ranking of the major players, along with new service/product launches, partnerships, business expansions, and acquisitions in the past five years of companies profiled• Extensive company profiles comprising of company overview, company insights, product benchmarking, and SWOT analysis for the major market players• The current as well as the future market outlook of the industry with respect to recent developments which involve growth opportunities and drivers as well as challenges and restraints of both emerging as well as developed regions• Includes in-depth analysis of the market of various perspectives through Porter’s five forces analysis• Provides insight into the market through Value Chain• Market dynamics scenario, along with growth opportunities of the market in the years to come• 6-month post-sales analyst support

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Table of Content

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