Global Back Grinding Tapes (BGT) Market Size By Type (UV Type, Non-UV Type), By Application (Standard, Standard Thin Die, (S)DBG (GAL), Bump), By Geographic Scope And Forecast

Back Grinding Tapes (BGT) Market Size And Forecast

Back Grinding Tapes (BGT) Market size is valued at USD 208.44 Million in the year 2021 and it is expected to reach USD 331.89 Million in 2030, growing at a CAGR of 5.30% from 2023 to 2030.

The market is expected to expand due to rising demand for miniature devices and technological advancements in the semiconductor industry. Other key market opportunities include the expansion of the electronics industry and the increased adoption of 5G technology in the regions such as North America, and Asia Pacific. The Global Back Grinding Tapes (BGT) Market report provides a holistic evaluation of the market. The report offers a comprehensive analysis of key segments, trends, drivers, restraints, competitive landscape, and factors that are playing a substantial role in the market.

Global Back Grinding Tapes (BGT) Market Definition

Back Grinding Tapes (BGT) is employed to protect the wafer surface during back grinding after the IC has been established on the wafer. When attached to the circuit surface, it protects the circuit surface from damage and pollution, and it enhances wafer grinding accuracy. Back Grinding Tapes (BG tapes) adhere to the circuit surface formed on silicon wafers in semiconductor front-end processes.

When grinding the backside of wafers, they shield the circuits from foreign matter and physical shocks. As a result, they must have low contamination properties for circuit surfaces, ease of releasability, and followability to circuit surface unevenness. Because BG tapes adhere to the circuit surface of silicon wafers, they must be non-contaminating.  Wafers after back grinding are getting increasingly thinner as films formed on silicon wafers become thinner and thinner.

When peeling BG tapes, wafers may crack if the adhesive force is too strong. As a result, tapes must be easily accessible. Fine irregularities can be found in silicon wafer-based circuits.  If BG tapes do not follow these irregularities and bubbles or gaps, groundwater used in wafer grinding can contaminate circuits. Furthermore, the formation of dimples as a result of stress concentration may allow wafers to crack and chip during grinding. As a result, BG tapes are required to have a high followability to irregularities on the circuit surface.

However, in recent years, wafer-level chip size packages (WLCSPs) have become increasingly popular.  Bump electrodes with a height of 200m or higher mount on circuits formed on the wafer in WLCSPs, making it hard for general-purpose BG tapes to secure followability for these wafers.

Global Back Grinding Tapes (BGT) Market Overview

Surface and air disinfection treatment for micro-biological purity is critical in pharmaceutical, medical, forensic, and biological laboratories. These facilities require the bare minimum in isolation conditions for continuous procedures that may eventually result in the formation of these tapes. In addition to the industries, the hospitality industry is a significant one that is increasingly embracing Back Grinding Tapes (BGT).

You'll find it popping up in all sorts of places, from cleaning the air to treating water and surfaces. All this innovation and new versions are really meant to help the market grow. With more money being spent on things like schools and roads, the global market should keep getting bigger. We're seeing more UV equipment being used, and governments worldwide are putting effort into building new water and wastewater treatment plants. It's also a common part of how you heal after an injury (the second stage, specifically!). Looking ahead, the Back Grinding Tapes market (BGT) is also expected to do well.

Guidelines that provide improved safety measures are expected to fuel market growth over the forecast period. UV technology is inexpensive, has improved efficacy, has a low operating cost, and has little environmental impact. This is due to increased global competition among various industries in producing Back Grinding Tapes with high consumer convenience, longer shelf life, and enhanced shelf appeal.

The product’s advancement is assisting the market’s growth. However, when compared to other production systems, wafer production is expensive. It is an extremely costly procedure. At some points, each new wafer product necessitates high design and manufacturing costs. Furthermore, because of its complexity, the wafer’s cost is much higher. As a result of these challenges, the overall cost of wafer production packaging is increasing. However, this issue will be resolved in some way over time. If this issue is resolved, the market will start to grow.

Market Attractiveness

The image of market attractiveness provided would further help to get information about the region that is majorly leading in the Global Back Grinding Tapes (BGT) Market. We cover the major impacting factors driving the industry growth in the given region.

Porter’s Five Forces

The image provided would further help to get information about Porter’s five forces framework providing a blueprint for understanding the behavior of competitors and a player’s strategic positioning in the respective industry. Porter’s five forces model can be used to assess the competitive landscape in the Global Back Grinding Tapes (BGT) Market, gauge the attractiveness of a certain sector, and assess investment possibilities.

Global Back Grinding Tapes (BGT) Market Segmentation Analysis

The Global Back Grinding Tapes (BGT) Market is Segmented on the Basis of Type, Application, And Geography.

Back Grinding Tapes (BGT) Market, By Type

• UV Type
• Non-UV Type

Based on Type, the market is segmented into UV Type, and Non-UV Type. The UV-type segment is expected to have the largest market share in 2021.  Adhesives with ultraviolet (UV) release properties. Using technologies developed for dicing tapes, these adhesives peel tapes without damaging thin silicon wafers. When the initial adhesive force with respect to the wafer is low, tapes peel off the wafer during the back grinding process, allowing groundwater to infiltrate. It is also applicable to a wide range of workpieces, including ceramics, glass, sapphire, and so on.

Back Grinding Tapes (BGT) Market, By Application

• Standard
• Standard Thin Die
• (S)DBG (GAL)
• Bump

Based on Application, the market is segmented into Standard, Standard Thin Die, (S)DBG (GAL), and Bump. The standard segment is expected to expand during the forecast period. Back Grinding Tapes (BGT) are frequently utilized in the semiconductor industry for the back-end processing of integrated circuits (ICs). They play an important role in the standard IC manufacturing process.

Back Grinding Tapes (BGT) Market, By Geography

• North America
• Europe
• Asia Pacific
• Latin America
• Middle East and Africa

On the basis of Geography, the global Back Grinding Tapes (BGT) Market is classified into North America, Europe, Asia Pacific, and the Rest of the world. Asia-Pacific is expected to account for the largest share of the market due to the presence of major semiconductor manufacturers and the growing electronics industry in countries such as China, Japan, and South Korea. Due to the region’s large population, Asia Pacific has seen the fastest growth in in-home consumer electronics.

Key Players

The “Global Back Grinding Tapes (BGT) Market” study report will provide valuable insight with an emphasis on the global market. The major players in the market are Nitto Denko Corporation, Furukawa Electric Co., Ltd., LINTEC Corporation, Mitsui Chemicals, Inc., AI Technology, Inc., Denka Company Limited, Hitachi Chemical Co., Ltd., AMC Corporation, Alltech Corporation, Pantech Tape Co., Ltd., Dexerials Corporation, Denka Company Limited, Fujipoly America Corporation, AIT (Advanced Tape Technology) among others.

Our market analysis also entails a section solely dedicated to such major players wherein our analysts provide insight into the financial statements of all the major players, along with product benchmarking and SWOT analysis. The competitive landscape section also includes key development strategies, market share, and market ranking analysis of the players mentioned above globally.

Ace Matrix Analysis

The Ace Matrix provided in the report would help to understand how the major key players involved in this industry are performing as we provide a ranking for these companies based on various factors such as service features & innovations, scalability, innovation of services, industry coverage, industry reach, and growth roadmap. Based on these factors, we rank the companies into four categories as Active, Cutting Edge, Emerging, and Innovators.

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Reasons to Purchase this Report

We'll take a good look at the market, digging into both the numbers and the less tangible stuff by breaking it down into different groups. You'll get market size data in USD Billion for each of those groups. We'll also point out which region and segment we think is going to be the fastest grower and the one that's going to be on top. Plus, we'll analyze each region, looking at how much of the product/service they're using and the things that are influencing the market there. We'll map out the competitive landscape, showing you who the major players are, along with their new offerings, alliances, expansions, and acquisitions over the last five years, complete with detailed profiles—company overview, insights, product comparisons, and SWOT analysis—for the big names. Expect a rundown of the current and future state of the industry, including where the opportunities and drivers are, as well as the challenges in both new and mature regions. We'll even dive deep using Porter's five forces analysis and give you insight into the market through the Value Chain. Finally, we'll lay out the market's dynamics and growth opportunities for the future, all backed up with 6 months of analyst support after your purchase.

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