Global Semiconductor Epoxy Mold Compound Market Size By Product Type (Phenolic, Epoxy, Polyester), By Application (Electricals Equipment, Aerospace, Automotive), By Geographic Scope And Forecast

Published Date: August - 2024 | Publisher: MIR | No of Pages: 320 | Industry: latest updates trending Report | Format: Report available in PDF / Excel Format

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Global Semiconductor Epoxy Mold Compound Market Size By Product Type (Phenolic, Epoxy, Polyester), By Application (Electricals Equipment, Aerospace, Automotive), By Geographic Scope And Forecast

Semiconductor Epoxy Mold Compound Market Size And Forecast

Semiconductor Epoxy Mold Compound Market size is growing at a moderate pace with substantial growth rates over the last few years and is estimated that the market will grow significantly in the forecasted period i.e. 2022 to 2030.

The world of semiconductor epoxy mold compounds is all about protecting delicate electronics. Think of Epoxy Molding Compound (EMC) as a cozy shell for sensitive gadgets. EMC offers a bunch of halogen-free options to fit all sorts of needs and wants. What makes epoxies so great? They're tough! They can handle a lot, and they keep your electronics safe and sound. Plus, they're safe to use. All these perks mean the market for epoxy molding is predicted to keep growing. With more and more automation and cool tech popping up everywhere, the demand for epoxy bulk molding compounds is really taking off! You can learn more here.

The ever-increasing urbanization and subsequently progress transport networks have led to epoxy molding compound demand. As epoxy molding compounds are characteristically more long-lasting than their regular counterparts, they are also increasingly preferred in dissimilar applications and industries. They also exhibit molding ability under compression and injection molding methods

Global Semiconductor Epoxy Mold Compound Market Definition

Semiconductor molding compounds? Think of them as carefully poured, electrically sound materials - perfect for the tiny world of semiconductor packaging that's so important these days. They're made with incredibly small fillers, flow with a beautiful twist, and stay electrically stable even when things get hot. The epoxy molding compounds specifically designed for semiconductors are like a perfect match for common die substrates, expanding and contracting at just the right rate (that's CTE matched!). They're even created with those nano packages in mind. These compounds do it allthey cover and protect the delicate die and its wire bonding, all while passing even the toughest tests for moisture and temperature. And for encapsulating those powerful, discrete semiconductors that run really hot? You absolutely need excellent electrical stability in the epoxy molding compound.

These molding compounds are known for their super low ionic content and incredibly high dielectric strength. Plus, they've got mass stable dielectrics and minimal ionic conductivity, even when the temperature goes wild! Epoxy Molding Compounds (EMC), as you might expect, are naturally fantastic at electrical insulation. People often call Epoxy Mold Compounds "functional epoxies" or "high solid epoxies" because they're packed with fillers – think mostly silica, though you'll find other stuff in there too, like materials that boost thermal conductivity. These fillers are loaded by weight, naturally. All this filler gives epoxy molding compounds awesome dielectric strength and a super high malfunction voltage, which, yeah, makes them great insulators. But, honestly, those two values don't really tell the whole story when it comes to what we really mean by "Good electrical stability".

Global Semiconductor Epoxy Mold Compound Market Overview

Think of molding compound as a special binder system. It's basically a mix of resin, hardener, and some other secret ingredients, all stirred together to make a putty or paste. The cool thing is, you can easily squish it into just about any shape you need. Once it's in place, it hardens into a solid, keeping that shape! You can use it all by itself, or team it up with other materials like wood, fabric, or even metals to create cool furniture or give things a little extra flair. Some common types? You've got your Polyurethane (PU), Phenolic Resin, Acrylic Polymer, and Epoxy Resin. And get this – with LEDs taking over from old-school bulbs like incandescent and fluorescent ones, there's a huge demand for compound semiconductors right now.

LEDs are popping up everywhere these days – from the lights in your house to car headlights and even those big signage displays you see. But here's the thingbuilding these fancy "compound semiconductor" devices that power LEDs costs a lot more overall than making your basic silicon chips. Part of the reason? It's just plain harder to design them! Designers are constantly wrestling with making them super efficient, while also trying to keep the cost down and the design simple. Plus, because LEDs are used for so many different things, designing the power and RF components is even more of a headache.

Global Semiconductor Epoxy Mold Compound MarketSegmentation Analysis

The Global Semiconductor Epoxy Mold Compound Market is Segmented on the basis of Product Type, Application, and geography.

Semiconductor Epoxy Mold Compound Market, By Product Type

• Phenolic• Epoxy• Polyester

Based on Product Type, the market is segmented into Phenolic, Epoxy, and Polyester. Among all epoxy resin is the best compound. Epoxy wax is a thermosetting polymer. They possess a high molecular weight, which provides an extremely high degree of toughness and fixing to other materials. It consists of two reactive elements that can be activated by mixing them together with heat or solvent catalysts to form a thermosetting polymer.

Semiconductor Epoxy Mold Compound Market, By Application

• Electricals Equipment• Aerospace• Automotive

Based on Application, the market is segmented into Electricals Equipment, Aerospace, and Automotive. Among all Electricals Equipment dominates the market. Molding compounds are handed-down in electricals to provide protection from short circuits, insulation, and moisture resistance. The molding element is a thermosetting plastic that can be molded into different shapes and sizes for a wide range of appeals such as automotive components and electricity-related products like switch gears etc.

Semiconductor Epoxy Mold Compound Market, By Geography

• North America• Europe• Asia Pacific• Rest of the world

On the basis of Geography, the Global Semiconductor Epoxy Mold Compound Market is classified into North America, Europe, Asia Pacific, and the Rest of the world. The North American market is expected to account for the largest market and the Asia Pacific is likely to witness the highest growth rate through the forecasted period.

Key Players

The “Global Semiconductor Epoxy Mold Compound Market” study report will provide valuable insight with an emphasis on the global market. The major players in the market are Hexion, Hitachi Chemical, BASF, Huntsman International, Eastman Chemical, Kyocera Chemical, Evonik Industries, Kolon Industries, Ashland, Kukdo Chemicals.

Our market analysis also entails a section solely dedicated to such major players wherein our analysts provide an insight into the financial statements of all the major players, along with its product benchmarking and SWOT analysis. The competitive landscape section also includes key development strategies, market share, and market ranking analysis of the above-mentioned players globally.

Key Developments

• In May 2020, OSRAM, the subsidiary of ams, introduced a new OSRAM 24V TEC Flex family that offers uniform illumination for a broad range of indoor and outdoor applications. TEC Flex Tunable White (TW) can be used for perpetual modulating the color temperature from 2700 K to 6500 K while keep going a high color yield.

• In March 2020, ON Semiconductor entered into a 5-year acceptance with GT Advanced Technologies (GTAT) (US) for the production and supply of silicon carbide material. With this acceptance, GTAT will produce and supply its CrystX silicon carbide (SiC) material to ON Semiconductor.

• In February 2020, Qorvo finished the possession of Decawave (Ireland), a pioneer in ultra-wideband (UWB) technology and provider of UWB solutions for mobile, automobile, and IoT applications. The Decawave team has enhanced the Ultra-Wideband Business Unit (UWBU) within the Qorvo Mobile Products portion.

Report Scope

REPORT ATTRIBUTESDETAILS
Study Period

2018-2030

Base Year

2021

Forecast Period

2022-2030

Historical Period

2018-2020

Key Companies Profiled

Hexion, Hitachi Chemical, BASF, Huntsman International, Eastman Chemical, Kyocera Chemical, Evonik Industries, Kolon Industries

Segments Covered
  • By Product Type
  • By Application
  • By Geography
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Free report customization (equivalent to up to 4 analyst working days) with purchase. Addition or alteration to country, regional & segment scope

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