Global Ajinomoto Build-up Film Substrate Market Size By Type (4-8 Layers ABF Substrate, 8-16 ABF Substrate), By Application (PCs, AI Chip, Server And Switch), By Geographic Scope And Forecast

Ajinomoto Build-up Film Substrate Market Size And Forecast

Ajinomoto Build-up Film Substrate Market size was valued at USD 1.45 Billion in 2024 and is projected to reach USD 6.57 Billion by 2031, growing at a CAGR of 20.76% from 2024 to 2031.

With the growing global population, the demand for consumer electronics such as laptops, smartphones, and tablets, PCs, and notebooks is projected to rise as it is considered a significant portion contributing to the growth of the Ajinomoto Build-up Film Substrate Market. The Global Ajinomoto Build-up Film Substrate Market report provides a holistic evaluation of the market. The report offers a comprehensive analysis of key segments, trends, drivers, restraints, competitive landscape, and factors that are playing a substantial role in the market.

Global Ajinomoto Build-up Film Substrate Market Definition

ABF substrate, an innovative component, was pioneered by Intel in the late 1990s to enhance the power of microprocessors. It derives its name from Ajinomoto Co., a Japanese multinational food and biotechnology corporation. This material gained prominence as the preferred packaging technology for central processing units (CPUs) in personal computers and servers, enabling fast computations by high-end chips. Consequently, ABF substrate became a vital element in the development of microelectronics.

Intel discovered that ABF substrate served as an exceptional electrical insulation material for intricate circuit designs, and chipmakers in the market utilized it to build high-performance computing (HPC) microprocessors that fueled the PC revolution in the 1990s. Today, ABF enables the functionality of robust server processors, networking ICs, laptop and desktop chipsets, and autonomous vehicle systems. It represents the cutting-edge production process for high-end IC substrates and exhibits significant growth potential.

ABF substrate plays a crucial role in the protective packaging of the few chips necessary to power computers or vehicles, facilitating communication among them. Advancements in circuit integration have enabled the creation of CPUs composed of nanometer-scale electronic circuits. ABF substrate facilitates the formation of these micrometer-scale circuits due to its laser processing compatibility and direct copper plating capabilities. Currently, ABF serves as an indispensable material for establishing the circuitry that guides electron flow from nanoscale CPU terminals to millimeter-scale terminals on printed substrates.

Global Ajinomoto Build-up Film Substrate Market Overview

ABF is now a critical component of the circuitry that guides electron flow from nanoscale CPU terminals to millimeter-scale terminals on printed substrates. Over the projection period, demand for ABF is expected to rise due to the increasing adoption of tablet PCs. According to a technology industry research firm, global tablet PC shipments are anticipated to reach almost 140 million units by 2022, up from 127 million units in 2018. ABF substrate is a crucial part of microelectronics and acts as a superior electrical insulation material for its most intricate circuit designs.

Okay, so the Semiconductor Industry Association (SIA) just dropped some newsworldwide chip sales hit a whopping $47.2 billion in August 2021! That's a crazy 29% jump compared to August 2020, when sales were at $36.4 billion. And get this, it's also about 3.3% higher than July 2021's $45.7 billion. All this growth in the semiconductor world is expected to be a major boost for the Ajinomoto Build-up Film Substrate Market, mainly because of its special qualities like high critical electric field strength and bandgap. Plus, let's be real, with a growing middle class, changing lifestyles, and everyone wanting the latest smart gadgets, consumer electronics are just taking off!

More money in people's pockets means they'll want more cool gadgets! Plus, governments everywhere are pushing for everything to go digital, which means even more folks will be grabbing the latest electronics, fueling the Ajinomoto Build-up Film Substrate Market. The market's booming because tech is getting awesome and people are earning more. And with the world's population just getting bigger and bigger, we're seeing a huge jump in demand for stuff like laptops, smartphones, and tablets. These consumer electronics are a big part of what's driving growth in the Ajinomoto Build-up Film Substrate Market.

Market Attractiveness

The image of market attractiveness provided would further help to get information about the region that is majorly leading in the Global Ajinomoto Build-up Film Substrate Market. We cover the major impacting factors that are responsible for driving the industry growth in the given region.

Porter’s Five Forces

The image provided would further help to get information about Porter’s five forces framework providing a blueprint for understanding the behavior of competitors and a player’s strategic positioning in the respective industry. Porter’s five forces model can be used to assess the competitive landscape in Global Ajinomoto Build-up Film Substrate Market, gauge the attractiveness of a certain sector, and assess investment possibilities.

Global Ajinomoto Build-up Film Substrate MarketSegmentation Analysis

The Global Ajinomoto Build-up Film Substrate Market is segmented on the basis of Type, Application, And Geography.

Ajinomoto Build-up Film Substrate Market, By Type

• 4-8 Layers ABF Substrate
• 8-16 ABF Substrate
• Others

To Get Summarized Market Report By Type-

Based on Type, the market is bifurcated into 4-8 Layers ABF Substrate, 8-16 ABF Substrate, and Others. The market for 4-8 layers of ABF substrate is going to grow on account of their growing application in mobile, PC, and servers. The worldwide growing fleet of smartphones, tablet laptops, and data centers are the primary growth factors.

Ajinomoto Build-up Film Substrate Market, By Application

• PCs
• AI Chip
• Server and Switch
• Game Consoles
• Others

To Get Summarized Market Report By Application-

Based on Application, the market is bifurcated into PCs, AI Chip, Server and Switch, Game Consoles, and Others. Over the projection period, demand for ABF is expected to rise due to the increasing adoption of tablet PCs. According to Canalys, a technology industry research group, global tablet PC shipments might reach 141 million units by 2022, up from 127 million units in 2018. This would majorly drive the segment demand over the forecast period.

Ajinomoto Build-up Film Substrate Market, By Geography

• North America
• Europe
• Asia Pacific
• Rest of the world

To Get a Summarized Market Report By Geography-

Based on Geography, the Global Ajinomoto Build-up Film Substrate Market is classified into North America, Europe, Asia Pacific, and the Rest of the world. The North American region holds a large share of the Ajinomoto Build-up Film Substrate Market. North America also brings in a lot of revenue from ABF substrates being used in electronic devices. With the increasing electronic industry, the application of semiconductors in various electronic devices keeps on increasing, thereby creating tremendous market opportunities for the Ajinomoto Build-up Film Substrate Market in the coming years.

Many policymakers perceive U.S. strength in semiconductor technology and fabrication, as an essential component of U.S. economic and national security interests. In addition, six U.S.-headquartered or foreign-owned semiconductor companies currently operate 20 fabrication facilities, or fabs, in the United States. Thus, owing to increasing research and development, technological advancement, and emerging players, the U.S. ABF substrate industry dominates the North American region.

Key Players

The “Global Ajinomoto Build-up Film Substrate Market” study report will provide valuable insight with an emphasis on the global market. The major players in the market are Ajinomoto Co., Inc., Unimicron Technology Corp, Nan Ya Printed Circuit Board Corporation, AT & S, Samsung Electro-Mechanics (SEMCO), Kyocera, TOPPAN, ASE Material, LG Inno Tek, Shennan Circuit, and IBIDEN CO., LTD.

The competitive landscape section also includes key development strategies, market share, and market ranking analysis of the above-mentioned players globally.

Key Developments