Global Advanced Packaging Technologies Market Size By Type (3D Integrated Circuit, 2D Integrated Circuit), By Industrial Vertical (Automotive And Transport, Consumer Electronics), By Geographic Scope And Forecast

Advanced Packaging Technologies Market Size And Forecast

Advanced Packaging Technologies Market size was valued at USD 4.24 Billion in 2020 and is projected to reach USD 9.28 Billion by 2028, growing at a CAGR of 10.29% from 2021 to 2028.

The world of advanced packaging technologies is booming! Why? Because it's simply better than the old waysmore efficient, uses less power, and perfectly fits the shrinking size of our electronics. Think about it – the huge demand for advanced wafer packaging to power the ever-expanding Internet of Things (IoT) and those blazing-fast next-gen mobile chipsets is really pushing this market forward. Plus, all the cool new tech and the money being poured into research and development are only adding fuel to the fire. Want the inside scoop? The Global Advanced Packaging Technologies Market report gives you the full picture. It breaks down all the important parts, trends, what's helping and hurting the market, who's competing, and everything else that's shaping this exciting field.

Global Advanced Packaging Technologies Market Definition

Advanced packaging is the combination and interconnection of components before traditional electronic packaging. Advanced packaging allows multiple devices (electrical, mechanical, or semiconductor) to be integrated and packaged as a single electronic device. Unlike traditional electronic packaging, advanced packaging makes use of semiconductor fabrication facilities’ processes and techniques. Advanced Packaging Technologies is a combination of various techniques such as 2.5D, 3D-IC, wafer-level packaging, and many others. It facilitates the integrated circuits, to enclose in the case which prevents the corrosion of the metallic parts and physical damage.

The packaging techniques used rely on various parameters such as power consumption, operating conditions, measurable size, and cost. These technologies are widely used in the industrial and automotive sectors. Advanced packaging has changed semiconductor production methods and brought up a new paradigm in chip design. Foundries have benefited more and more from the automation of advanced packaging processes, which has been aided by increased electronic design automation programs. Advanced packaging is being developed to fulfill the various conditions of power dissipation, field operation, and, most importantly, cost.

The need for high-performance semiconductors in a variety of consumer electronics has fueled the growth of the Advanced Packaging Technologies Market. The demand for 3D and 2.5D packaging in semiconductors used in smartphones and other mobile devices has risen as a result. The adoption of next-generation semiconductor platforms is accelerating the use of advanced packaging techniques. Key semiconductor packaging companies have developed lots of new innovative system-level chip designs during the last few years. Chipmakers have been able to come up with new designs because of new heterogeneous integration techniques for merging nodes in chip manufacturing.

Global Advanced Packaging Technologies Market Overview

The market for advanced packaging technologies is witnessing tremendous growth owing to its efficiency over the conventional packaging method, less power consumption, and satisfactory requirement as per the size of electronic devices. With more advanced packaging chip technologies such as 2.5D and 3D glass and silicon interposers, chip packaging technology that fulfills industry standards for size, power, yield, and cost continues to evolve. For both front-end foundries and back-end packaging vendors, these novel and unique procedures to link and integrate chips into final assemblies create new challenges in deposition, etch, lithography, inspection, singulation, and clean.

The growing need for advanced wafer packaging techniques for fast expanding IoT and next-generation mobile chipsets is driving the Advanced Packaging Technologies Market. Furthermore, advancement in technologies and increasing investments in R&D activities are expected to drive the growth of the market. The rising use of artificial intelligence in industrial automation will boost demand for high-end chips made with advanced packaging. Lithography fabrication technologies have gained popularity in the Advanced Packaging Technologies Market.

Additionally, among packaging service providers, heterogeneous integration solutions are growing rapidly. The Advanced Packaging Technologies Market is being boosted by a rapidly increasing logic chip industry in developing regions. Wafer manufacturing service providers have worked diligently over the last several years to increase their product offerings and meet the demands of internationally recognized semiconductor manufacturers. However, an increase in the problem of device heating and a lack of standardization are among the primary factors restraining market growth and will continue to provide a hindrance to the expansion of the Advanced Packaging Technologies Market.

Furthermore, demand for high-performance devices has increased in developing nations, additionally, in the forecast period of 2021-2028, the rise in developing trends of fan-out wafer-level packaging, as well as the expansion in the packaged food sector in emerging economies, would provide new opportunities for the Advanced Packaging Technologies Market. This will make it much easier for advanced packaging solution providers to deliver innovative fan-out packaging technologies. Semiconductor lines are also being expanded by major players in the Advanced Packaging Technologies Markett.

Global Advanced Packaging Technologies Market Segmentation Analysis

The Global Advanced Packaging Technologies Market is Segmented on the basis of Type, Industrial Vertical, And Geography.

Advanced Packaging Technologies Market, By Type

• 3D Integrated Circuit• 2D Integrated Circuit• 2.5D Integrated Circuit• Others

Based on Type, The market is classified into 3D Integrated Circuit, 2D Integrated Circuit, 2.5D Integrated Circuit, and Others. Three-Dimensional Integrated Circuit (3DIC) is a packaging technique that collects and layers homogeneous or heterogeneous dies vertically into Multi-Chip-Module (MCM) with Through-Silicon-Via (TSV). It’s a mono- or multi-functional integration platform. Two, four, or eight memories might be combined in a single package. CPU, GPU, DRAM, and main-broad may all be into one chip package in the future. 3DIC is a high-bandwidth, small-form-factor, multi-function integration solution.

Advanced Packaging Technologies Market, By Industrial Vertical

• Automotive & Transport• Consumer Electronics• Industrial• IT & Telecommunication• Others

Based on Industrial Vertical, The market is classified into Automotive & Transport, Consumer Electronics, Industrial, IT & Telecommunication, and Others. FOWLP (fan-out wafer-level packaging) has emerged as a promising technology for meeting the ever-increasing needs of consumer electronics. Specific features such as substrate-less packaging, lower thermal resistance, and higher performance due to shorter interconnect combined with direct IC connection through the use of thin-film metallization instead of standard wire bonds or flip-chip bumps, as well as more moderate parasitic effects, are significant advantages of this type of packaging.

Advanced Packaging Technologies Market, By Geography

• North America• Europe• Asia Pacific• Rest of the world

On the basis of Geography, The Global Advanced Packaging Technologies Market is classified into North America, Europe, Asia Pacific, and the Rest of the world. In the Asia Pacific and North America, the global advanced packaging industry is producing significant revenue. A rapidly increasing semiconductor industry, particularly in the Asia Pacific, to meet a diverse range of customer demands for next-generation mobile devices. The IC industry has made tremendous progress in the region’s key economies, raising income from the Asia Pacific Advanced Packaging Technologies Market.

Key Players

The “Global Advanced Packaging Technologies Market” study report will provide a valuable insight with an emphasis on global market including some of the major players such as Amkor Technology, STATS ChipPAC Pte. Ltd, ASE Group, Siliconware Precision Industries Co., Ltd., SSS MicroTec AG, Jiangsu Changjiang Electronics Technology Co. Ltd, Intel Corporation, IBM Corporation, Taiwan Semiconductor Manufacturing Company, Qualcomm Technologies, Inc.

Our market analysis also entails a section solely dedicated to such major players wherein our analysts provide an insight to the financial statements of all the major players, along with its product benchmarking and SWOT analysis. The competitive landscape section also includes key development strategies, market share and market ranking analysis of the above-mentioned players globally.

Key Developments

• On July 2020, Amkor Technology outlined its efforts and achievements in creating and qualifying wire bond and flip-chip packaging for devices made using TSMC’s advanced low-k process technology. Amkor has also worked with a number of clients to qualify low-k products and anticipates a volume ramp-up for low-k packages.

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