Global 3D TSV And 2.5D Market Size By Packaging Technology (3D Through-silicon via (TSV), 5D), By End-User (Telecommunications, Automotive), By Geographic Scope And Forecast

3D TSV And 2.5D Market Size And Forecast

3D TSV And 2.5D Market size was valued at USD 50.3 Billion in 2023 and is projected to reach USD 224.3 Billion by 2030, growing at a CAGR of  31.10 % during the forecast period 2024-2030.

The market is attributed grow due to the increasing demand for faster, smaller, and power-efficient electronic devices is expected to fuel the adoption of advanced packaging technologies. Additionally, the increasing need for heterogeneous integration and system-level performance improvement is expected to drive the implementation of 3D TSV and 2.5D solutions. Moreover, the expanding applications of this technology in areas such as healthcare, automotive, consumer electronics, and telecommunications are expected to contribute to the market growth.

Global 3D TSV And 2.5D Market Definition

3D TSV (Through-Silicon Via) and 2.5D technologies are advanced packaging methods that enable the integration of several semiconductor chips or dies in electronic devices, which enhances the miniaturization, performance, and functionality of these devices. In 3D TSV, the vertical interconnects, or vias, are created through the silicon substrates that allow direct connection between the layers of the chips, which enables high-speed communication between the chips, thereby reducing the interconnects.

This allows lower power consumption, improved electrical performance, and increased design flexibility. The 2.5D, on the other hand, uses interposer substrates such as organic interposers that connect multiple dies or chips. The interposer acts as a bridge between the chips that enable the integration of heterogeneous components such as memory, processors, and sensors while also helping to improve the performance of the chips and providing efficient dissipation of heat.

Global 3D TSV And 2.5D Market Overview

The primary driver for the market is the growing demand for high-performance electronic devices. 3D TSV and 2.5D technologies have enabled the integration of multiple dies or chips, which provide improved performance through shorter signal paths, reduced interconnect lengths, and enhanced data transfer rates. This drives the adoption of these advanced packaging solutions, especially in applications where high speed and bandwidth are crucial, such as data centers, 5G communication systems, and artificial intelligence (AI).

Additionally, the growing emphasis of companies on thermal management and energy efficiency in electronic devices is expected to fuel the adoption of 3D TSV and 2.5D technologies. Due to the use of stacking technology, the length of interconnects reduces; this helps optimize power delivery and improve the power efficiency of the devices. Incorporating vertical integration and interposers in 2.5D integration further enables better thermal management and heat dissipation, reducing thermal challenges associated with densely packed chips.

The growing demand for integrating different chip technologies and functionalities, such as processors, sensors, memory, and RF components, drives the demand for the 3D TSV And 2.5D Market. These technologies enable heterogeneous integration, which allows a range of components to be interconnected and combined reduces latency, and improves the performance and functionality of the systems. This feature is increasing the adoption of packaging technology in high-end computing, automotive electronics, and advanced imaging system applications.

Further, with the ongoing advancements in materials, manufacturing processes, and design tools, the market is expected to grow lucratively in the forthcoming years. Improved wafer bonding processes, TSV fabrication techniques, and advanced interposer technologies have further contributed to the reliability, scalability, and cost-effectiveness of the packaging methods. As the industry continues to innovate and optimize these technologies, they are expected to be more accessible and attractive for a wider range of applications. Additionally, the growing demand for compact and smaller devices is predicted to drive the demand for the market as these packaging solutions enable the manufacturers to achieve a higher integration density and pack more functionality in smaller spaces.

Global 3D TSV And 2.5D Market Segmentation Analysis

The Global 3D TSV And 2.5D Market is segmented on the basis of Packaging Technology, End-User, And Geography.

3D TSV And 2.5D Market, By Packaging Technology

• 3D wafer-level chip-scale packaging (WLCSP)
• 3D Through-silicon via (TSV)
• 5D
• Others

Based on Packaging Technology, the market is differentiated into 3D wafer-level chip-scale packaging (WLCSP), 3D Through-silicon via (TSV), 5D, and Others. The 3D wafer-level chip-scale packaging (WLCSP) segment had the largest market share in 2022. The segment growth is attributed to the improved thermal performance and functionality of the 3D WLCSP in the printed circuit boards compared to the other technologies, such as 3D TSV and 2.5D. Additionally, the simplified manufacturing process for WLCSP that uses polymers with high-temperature sustainability that helps to address the thermal issues is expected to contribute to the demand for the segment.

3D TSV And 2.5D Market, By End-User

• Consumer Electronics Industrial
• Telecommunications
• Automotive
• Military & Aerospace
• Medical Devices
• Others

Based on End-User, the market is differentiated into Consumer Electronics Industrial, Telecommunications, Automotive, Military & Aerospace, Medical Devices, and Others. Consumer Electronics held the largest share in 2022. The growing memory requirement in smartphones and tablets is driving the demand for advanced memory such as Dynamic Random Access Memory, Double Data Rate, and flash memory, among several others, are expected to drive the segment growth. Additionally, research activities undertaken by the players to provide innovative products to consumers are expected to further drive segment growth.

3D TSV And 2.5D Market, By Geography

• North America
• Europe
• Asia Pacific
• Middle East and Africa
• Latin America

On the basis of Geographical Analysis, the Global 3D TSV And 2.5D Market is classified into Asia Pacific, North America, Europe, Latin America, and Middle East & Africa. North America dominated the market in 2022. The crucial factors responsible for the market growth in the region are the presence of technologically advanced infrastructure and key players in the region. Despite this, Asia Pacific is anticipated to grow lucratively due to the growing adoption of smartphones in the region. Additionally, growing urbanization and rapidly increasing population are favoring the market growth in the region.

Key Players

The “Global 3D TSV And 2.5D Market” study report will provide valuable insight with an emphasis on the global market including some of the major players such as Taiwan Semiconductor Manufacturing Company Limited, Amkor Technology, Broadcom Ltd, Intel Corporation, United Microelectronics Corp., Advanced Semiconductor Engineering Inc., STMicroelectronics NV., ASE Technology Holding Co., Ltd., Texas Instruments Inc., JCET Group Co. Ltd. This section provides a company overview, ranking analysis, company regional and industry footprint, and ACE Matrix.

Our market analysis also entails a section solely dedicated to such major players wherein our analysts provide an insight into the financial statements of all the major players, along with product benchmarking and SWOT analysis.

Key Developments

• In May 2023, United Microelectronics Corporation announced its 40nm RFSOI technology platform was ready for production of radio frequency (RF) and millimeter-wave (mmWave) front-end products that will enable the proliferation of 5G wireless networks and applications such as Fixed Wireless Access (FWA) systems, smartphones, and small cell base stations.

Ace Matrix Analysis

The Ace Matrix provided in the report would help to understand how the major key players involved in this industry are performing as we provide a ranking for these companies based on various factors such as service features & innovations, scalability, innovation of services, industry coverage, industry reach, and growth roadmap. Based on these factors, we rank the companies into four categories as Active, Cutting Edge, Emerging, and Innovators.

Market Attractiveness

The image of market attractiveness provided would further help to get information about the region that is majorly leading in the Global 3D TSV And 2.5D Market. We cover the major impacting factors driving the industry growth in the given region.

Porter’s Five Forces

The image provided would further help to get information about Porter’s five forces framework providing a blueprint for understanding the behavior of competitors and a player’s strategic positioning in the respective industry. Porter’s five forces model can be used to assess the competitive landscape in the Global 3D TSV And 2.5D Market, gauge the attractiveness of a particular sector, and assess investment possibilities.

Report Scope

Research Methodology of Market Research