Global Through Silicon Via (TSV) Technology Market Size By Product (Via First TSV, Via Middle TSV), By Application (Image Sensors, 3D Package, 3D Integrated Circuits), By Geographic Scope And Forecast

Through Silicon Via (TSV) Technology Market Size And Forecast

Through Silicon Via (TSV) Technology Market size was valued at USD 35.12 Billion in 2024 and is projected to reach USD 192.29 Billion by 2031, growing at a CAGR of 26.12% from 2024 to 2031.

The growing adoption of smart electronics products such as smartphones, laptops, tablets, and many others is leading to the exponential growth of Through Silicon Via (TSV) Technology. Since, these TSVs are majorly used in building 3D integrated circuits (ICs), and the IC packages which are one of the most vital components in smart electronics manufacturing. Besides this, the TSVs provide higher-density bonds, require minimal space, and provide the best connectivity compared to conventional flip-chips and wire bonds. The usability of TSVs and various electronic components such as microprocessing units (MPUs), PLDs, DRAMs, electronic chips for graphics and , and many others.

Global Through Silicon Via (TSV) Technology Market Definition

Through-silicon via (TSV) technology is the central and most crucial technology enabling the integration of the three-dimensional (3D) Si and 3D integrated circuit (IC). It offers the ability for the shortest chip-to-chip interconnections, and the interconnection of the smallest pad size and pitch. Stacking chips in three dimensional with through-silicon via (TSV) technology as interconnects is an emerging advanced packaging technology for CMOS imagers, memories, and MEMS. TSV technology offers several advantages as compared to traditional interconnection technology, including lower power consumption, better electrical performance, higher density, wider data width and thus bandwidth, and lighter weight.

A through-silicon via (TSV) refers to a vertical electrical connection that passes entirely through a wafer of silicone or dies. TSVs are higher-performance interconnect methods utilized to create 3D integrated circuits and 3D packages as an alternative to wire-bond and flip-chips. In this technique, the device and interconnect density is significantly higher, and the connection length becomes shorter. Market-driven application of through-silicon via (TSV) engaging memory comprises the integration of logic functions and memory for the improved video quality on handheld devices, multi-chip high-performance DRAM, and stacked NAND flash memory for solid-state drives.

Global Through Silicon Via (TSV) Technology Market Overview

The increasing use of semiconductor chips’ applications in various industries such as the power, medical, energy, automobiles, , motor control applications, and aerospace and defense is accelerating the growth of the Global Through Silicon Via (TSV) Technology Market. The rising use of light-emitting diodes in products has stimulated the production of higher capacity, lower cost, and higher density devices. Using three-dimensional (3D) packaging in TSV technology, unlike 2D packaging, allows for a higher density of vertical interconnections.

Furthermore, the increasing demand for the miniaturization of the electronic device owing to the compact size chip architecture is driving the development of through silicon via (TSV) technology. Various sectors, such as automotive, telecommunications, healthcare, and industrial manufacturing created the requirement for miniaturized semiconductor ICs. Also, the growing demand for TSV technology for 3D chip packaging to reduce interconnection length, reduce power dissipation, increase signal speed, and reduce power consumption presents a great opportunity for the Through Silicon Via (TSV) Technology Market growth.

However, the market vendors have to capitalize a lot on designing equipment to manufacture compact ICs. In addition to this, the production process is complex and also consumes more time. Also, the designing of the semiconductor ICs manufacturing process is becoming complex, therefore it would have a moderate impact on semiconductor chip manufacturers as they need to invest a great deal in packaging and assembly equipment to improve the performance of semiconductor ICs.

Global Through Silicon Via (TSV) Technology MarketSegmentation Analysis

The Global Through Silicon Via (TSV) Technology Market is segmented on the basis of Product, Application, and Geography.

Through Silicon Via (TSV) Technology Market, By Product

• Via First TSV
• Via Middle TSV
• Via Last TSV

Based on Product, the market is segmented into Via First TSV, Via Middle TSV, and Via Last TSV. The Via Middle TSV segment accounted for the largest market share in 2021. Via-middle TSV approaches typically insert the TSV module after completion of the FEOL phases, which consists of various high-temperature processes but before BEOL processing, where multi-layer metal routing is carried out. Via-middle TSVs are presently a prevalent option for advanced three-dimensional (3D) ICs and also for interposer stacks.

Through Silicon Via (TSV) Technology Market, By Application

• Image Sensors
• 3D Package
• 3D Integrated Circuits
• Others

Based on Application, the market is segmented into, 3D Package, 3D Integrated Circuits, and Others. The 3D Integrated Circuits segment accounted for the largest market share in 2021. 3-dimensional integration of integrated circuits (3DIC) using Through Silicon Vias (TSV) is one of the most promising but also challenging technology. Furthermore, increasing penetration of smartphones, feature phones & tablets, and technological advancements in consumer electronic devices are major factors driving the growth of the global 3D integrated circuit with the Through Silicon Via (TSV) Technology Market.

Through Silicon Via (TSV) Technology Market, By Geography

• North America
• Europe
• Asia Pacific
• Middle East and Africa
• Latin America

On the basis of Regional Analysis, the Global Through Silicon Via (TSV) Technology Market is classified into North America, Europe, Asia Pacific, Middle East and Africa, and Latin America. Asia Pacific dominated the Global Through Silicon Via (TSV) Technology Market in 2019. Countries such as China, Korea, and Japan utilize through-silicon via (TSV) technology on a large scale. These regions are considered the hub of electronics parts manufacturing. The presence of a large number of smartphone companies along with the kinship of consumers to adopt newer technology such as 5G technology will drive the market in the telecommunication sector.

These parent regions are further segmented as follows; Asia Pacific (China, India, Japan, Rest of APAC), Europe (Germany, UK, France, Spain, Italy, Rest of Europe), North America (US, Canada, Mexico), Latin America (Brazil, Argentina, Rest of LATAM), and Middle East & Africa (UAE, Saudi Arabia, South Africa, Rest of MEA).

Key Players

The “Global Through Silicon Via (TSV) Technology Market” study report will provide valuable insight with an emphasis on the global market. The major players in the market are AMS, Hua Tian Technology, Samsung, Amkor Micralyne, Inc., Intel Corporation, TESCAN, Dow Inc., WLCSP,  ALLVIA, Applied Materials, International Business Machines Corporation, Tezzaron Semiconductors, STATS ChipPAC Ltd, Xilinx, Renesas Electronics Corporation, Texas Instruments. Besides this, much new entrance and Through Silicon Via manufacturers from the respective economies are forming supply agreements with the Smart Electronics manufacturing companies to attain a competitive edge in the market.

Our market analysis also entails a section solely dedicated to such major players wherein our analysts provide an insight into the financial statements of all the major players, along with its product benchmarking and SWOT analysis. The competitive landscape section also includes key development strategies, market share, and market ranking analysis of the above-mentioned players globally.

Key Developments

• Samsung Electronics Co., Ltd. announced that it has developed the industry’s first 12-layer 3D-TSV (Through Silicon Via) technology. This new technology allows for the stacking of 12 DRAM chips using more than 60,000 TSV holes while maintaining the same thickness as current 8-layer chips.
• In September 2019, Teledyne Technologies Incorporated announced today that its subsidiary, Teledyne Digital Imaging, Inc., acquired Micralyne Inc. which is a privately-owned foundry providing Micro Electro Mechanical Systems or MEMS devices. In particular, Micralyne possesses unique microfluidic technology for biotech applications, as well as capabilities in non-silicon-based MEMS (e.g. gold, polymers) often required for human-body compatibility.

Ace Matrix Analysis

The Ace Matrix provided in the report would help to understand how the major key players involved in this industry are performing as we provide a ranking for these companies based on various factors such as service features & innovations, scalability, innovation of services, industry coverage, industry reach, and growth roadmap. Based on these factors, we rank the companies into four categories as Active, Cutting Edge, Emerging, and Innovators.

Market Attractiveness

The image of market attractiveness provided would further help to get information about the region that is majorly leading in the Global Through Silicon Via (TSV) Technology Market. We cover the major impacting factors that are responsible for driving the industry growth in the given region.

Porter’s Five Forces

The image provided would further help to get information about Porter’s five forces framework providing a blueprint for understanding the behavior of competitors and a player’s strategic positioning in the respective industry. Porter’s five forces model can be used to assess the competitive landscape in the Global Through Silicon Via (TSV) Technology Market, gauge the attractiveness of a certain sector, and assess investment possibilities.

Report Scope