Semiconductor Manufacturing Equipment Market – Global Industry Size, Share, Trends, Opportunity, and Forecast, 2018-2028, Segmented By Equipment Type (Front-end Equipment ((Lithography Equipment, Etching Equipment, Deposition Equipment, Metrology/Inspection Equipment, Material Removal/Cleaning Equipment, Photoresist Processing Equipment) and Back-end Equipment (Wafer Manufacturing Equipment, Assem

Published Date: November - 2024 | Publisher: MIR | No of Pages: 320 | Industry: ICT | Format: Report available in PDF / Excel Format

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Semiconductor Manufacturing Equipment Market – Global Industry Size, Share, Trends, Opportunity, and Forecast, 2018-2028, Segmented By Equipment Type (Front-end Equipment ((Lithography Equipment, Etching Equipment, Deposition Equipment, Metrology/Inspection Equipment, Material Removal/Cleaning Equipment, Photoresist Processing Equipment) and Back-end Equipment (Wafer Manufacturing Equipment, Assem

Global Semiconductor manufacturing equipment market is predicted to grow at a rapid pace throughout the forecast period. A semiconductor is a critical component of electronic equipment that enables advancements in telecommunication, computers, biotechnology, military technology, aviation, renewable energy, and other sectors. Semiconductor manufacturing equipment is used to create IC chips, memory chips, circuits, and a variety of other products. Initially, manufacturing equipment is utilized to produce silicon wafers, including wafer processing tools such as photolithography tools, etching machines, chemical vapor deposition machines, measurement devices, and process/quality control equipment. The market is divided into supply chain processes, which include IDM, OSAT, and foundry.

One of the primary drivers of the semiconductor manufacturing equipment market is the increasing demand for consumer electronics, such as smartphones and laptops, which is driving the need for smaller, faster, and more efficient semiconductors. The development of the Internet of Things (IoT) has also fueled the demand for semiconductors, which can help connect devices and enable them to communicate with each other. Furthermore, the trend of miniaturization is driving the demand for smaller and more precise semiconductors, leading to the development of advanced semiconductor manufacturing technologies, such as 3D ICs, which require specialized equipment. Despite intense competition in the market, the industry is still dominated by a few large players who have the resources to invest in research and development and offer innovative products.

Technological advancements

The semiconductor manufacturing equipment market is driven by technological advancements in the semiconductor industry. With the increasing demand for smaller, faster, and more efficient semiconductors, the need for advanced manufacturing technologies has also increased. This has led to the development of innovative semiconductor manufacturing technologies such as 3D ICs, FinFETs, and others, which require specialized equipment.

Increasing demand for electronic devicesThe demand for electronic devices such as smartphones, laptops, and tablets has been increasing rapidly. The semiconductor industry is a crucial component of the electronics industry, and as the demand for electronic devices increases, the demand for semiconductors also increases. This, in turn, drives the demand for semiconductor equipment, which is used in the manufacturing of semiconductors. Hence, the growing adoption of semiconductor manufacturing equipment in semiconductor market is expected to boost market growth. Emerging markets, such as Asia-Pacific, are experiencing rapid industrialization and urbanization, which has led to an increase in demand for electronic devices. Moreover, the countries in this region have a large population that is increasingly adopting technology, thereby increasing the demand for semiconductor devices. This, in turn, drives the demand for global semiconductor manufacturing equipment market.

Growing demand for third-party IC packaging to support OSAT vendor expansion

The outsourced semiconductor assembly and test (OSAT) supply chain process sector is predicted to develop during the forecast period, owing to the use of assembly, packaging, and testing services by consumer electronics and automotive manufacturers.

OSAT enterprises are looking for automated machinery and technology to integrate into their manufacturing facilities, allowing clients to outsource semiconductor and electronic devices. The increased requirement to maximize semiconductor fab time and capacity is encouraging OSAT participation to assure a speedier and consistent supply of semiconductors.

Challenges faced by the Market

The high cost of equipment is one of the major challenges that the semiconductor manufacturing equipment sector faces. Manufacturing semiconductor manufacturing equipment is a sophisticated and capital-intensive process that necessitates substantial investment in research and development. As a result, the cost of equipment is considerable, making it difficult for small and medium-sized businesses to enter the market.

Furthermore, the semiconductor manufacturing equipment industry is very competitive, with multiple manufacturers selling identical goods. This has resulted in increased rivalry, which has resulted in a drop in prices and margins. Yet, the industry is still controlled by a few major businesses with the ability to spend in R&D and create novel goods.

Recent Developments

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MIR Segment1

Market Segmentation

Company Profiles

Applied Materials Inc, ASML Holding Semiconductor Company, Tokyo Electron Limited, Lam Research Corporation, KLA Corporation, Veeco Instruments Inc, Screen Holdings Co. Ltd, Teradyne Inc, Hitachi High -Technologies Corporation, Ferrotec Holdings Corporation,

Attribute

Details

Base Year

2022

Historical Years

2018 â€“ 2021

Estimated Year

2023

Forecast Period

2024 – 2028

Quantitative Units

Revenue in USD Billion and CAGR for 2018-2022 and 2023E-2028F

Report Coverage

Revenue forecast, company share, competitive landscape, growth factors, and trends

Segments Covered

By Equipment Type

By Dimension

By Supply Chain Process

By Region

Regional Scope

Asia-Pacific, North America, Europe, Middle East & Africa and South America

Country Scope

China, Japan, India, Australia, South Korea, United States, Canada, Mexico, United Kingdom, Germany, France, Spain, Italy, Israel, Turkey, Saudi Arabia, UAE, Brazil, Argentina, Colombia

Key Companies Profiled

Applied Materials Inc, ASML Holding Semiconductor Company, Tokyo Electron Limited, Lam Research Corporation, KLA Corporation, Veeco Instruments Inc, Screen Holdings Co. Ltd, Teradyne Inc, Hitachi High -Technologies Corporation, Ferrotec Holdings Corporation.

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