SiC-on-Insulator (SiCOI) Film Market - By Substrate (Silicon (Si) Substrate, Silicon Carbide (SiC) Substrate, Sapphire Substrate), By Wafer Size, By Technology (Smart Cut Technology, Grinding/Polishing/Bonding Technology), By Application & Forecast, 2024 – 2032

SiC-on-Insulator (SiCOI) Film Market Size

SiC-on-Insulator (SiCOI) Film Market was valued at USD 25.3 million in 2023 and is estimated to register a CAGR of over 90% between 2024 and 2032. The expansion of 5G telecommunications infrastructure drives growth in the SiCOI film market owing to its suitability for high-frequency and high-power applications. SiCOI films offer superior thermal conductivity, allowing for efficient heat dissipation in 5G devices, ensuring optimal performance and reliability. Moreover, SiCOI's ability to withstand high temperatures and voltages aligns with the demanding requirements of 5G base stations and power amplifiers, making it a preferred choice for enhancing the efficiency & durability of 5G telecommunications equipment.

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The rising interest in energy-efficient devices serves as a significant growth driver for the SiCOI film market owing to the unique properties of SiCOI films. These films offer superior thermal conductivity, reduced power losses, and higher operational efficiency compared to traditional materials. As industries increasingly prioritize energy conservation and sustainability, the demand for SiCOI-based components in power electronics, renewable energy systems, and electric vehicles rises. This trend is fueled by regulatory initiatives promoting energy efficiency and the growing consumer awareness of environmental impacts, positioning SiCOI films as essential components of the next-generation energy-efficient devices.

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Limited availability of reliable data sources presents a significant pitfall for the SiCOI film market research due to the nascent nature of the technology and its specialized applications. Comprehensive market data, including production volumes, consumption trends, and pricing dynamics, may not be readily accessible or standardized. This scarcity of data hampers accurate market analysis, hindering strategic decision-making for stakeholders. Furthermore, the lack of reliable data impedes forecasting accuracy and makes it challenging to assess the true market potential, leading to uncertainties in investment and resource allocation within the industry.

SiC-on-Insulator (SiCOI) Film Market Trends

SiCOI films are increasingly being used in power electronics, such as inverters, converters, and motor drives, owing to their high thermal conductivity and breakdown voltage. These properties enable efficient heat dissipation and reliable operation at high voltages, improving the performance and durability of electronic components, especially in demanding applications such as electric vehicles and renewable energy systems.

SiCOI films are increasingly employed in photonics owing to their low optical loss and compatibility with silicon-based technologies. They enable the creation of optical waveguides and photonic integrated circuits, enhancing data transmission efficiency. This compatibility facilitates seamless integration into the existing silicon infrastructures, making SiCOI films a preferred choice for advancing photonic applications in various industries.

SiC-on-Insulator (SiCOI) Film Market Analysis

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Based on application, the SiC-on-insulator (SiCOI) film market is segmented into power electronics, aerospace and defense, automotive, consumer electronics, and others. The power electronics segment is expected to reach over USD 2.5 billion by 2032.
The increasing need for compact power electronics solutions fuels the adoption of SiCOI films as they offer high power density capabilities. Their ability to accommodate more power in smaller form factors makes them suited for applications where space is limited, such as in portable electronics, electric vehicles, and aerospace systems, driving their demand in diverse industries.

SiCOI films facilitate efficient power conversion and management in renewable energy systems, such as solar inverters and wind turbine converters, owing to their high thermal conductivity and low electrical losses. They enhance the performance and reliability of these systems, improving energy conversion efficiency and enabling seamless integration of renewable sources into the grid, thereby advancing sustainable energy initiatives.

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Based on wafer size, the market is segmented into 100 mm (4-inch) wafers, 150 mm (6-inch) wafers, 200 mm (8-inch) wafers, and 300 mm (12-inch) wafers. The 300 mm (12-inch) wafers segment is expected to register a CAGR of over 95% over the forecast period.

• 300 mm wafers provide a larger surface area for SiCOI film deposition, maximizing the number of devices that can be fabricated per wafer. This increased space allows for more efficient utilization of materials and resources, leading to higher device yield and lower production costs compared to smaller wafer sizes.
• As the demand for SiCOI-based devices rises in power electronics and photonics, higher production capacity becomes essential. 300 mm wafers offer the scalability needed to meet this demand efficiently. Their larger surface area allows for increased throughput, enabling manufacturers to produce more SiCOI-based devices in less time, thus addressing the growing market needs effectively.

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North America dominated the global SiCOI film market in 2023 with over 40% of the total revenue share. There is a strong emphasis on technological innovations and adoption, particularly in industries such as automotive, aerospace, and telecommunications, where SiCOI films find diverse applications. Additionally, robust investments in research & development, coupled with supportive government initiatives and favorable regulatory frameworks, foster market expansion. Moreover, strategic partnerships between industry players and research institutions further drive innovations and market growth in the region.

SiC-on-Insulator (SiCOI) Film Market Share

Soitec and Sicoxs Corporation held a significant share of over 20% in the SiCOI film market in 2023. Soitec, based in France, is a leader in semiconductor materials. It specializes in engineered substrates, offering innovative solutions for electronics and energy markets. In the SiCOI films market, the company provides advanced materials that enable high-performance power electronics and photonics applications, leveraging its expertise in semiconductor engineering to meet industry demands for efficiency and reliability.

Sicoxs Corporation, based in Japan, specializes in the development and production of SiCOI films. It offers advanced semiconductor materials for various applications, including power electronics, photonics, and renewable energy systems. The company focuses on leveraging SiCOI films properties, such as high thermal conductivity and low optical loss, to enhance the performance and efficiency of electronic devices.

SiC-on-Insulator (SiCOI) Film Market Companies

Major players operating in the SiCOI film industry are

• MTI Corporation
• NGK Insulators, Ltd.
• SICC Co., Ltd.
• Sicoxs Corporation
• Soitec
• Sumitomo Electric Industries, Ltd.
• Wolfspeed, Inc.

SiC-on-Insulator (SiCOI) Film Industry News

• In December 2022, SOITEC collaborated with STMicroelectronics, a global semiconductor player, to advance its SiC substrate technology. SOITEC SmartSiC technology was integrated into ST's 200 mm substrate manufacturing, enhancing the company’s devices and modules.
• In May 2022, Soitec released its first 200mm silicon carbide SmartSiC wafer, thus expanding its SiC product portfolio beyond 150mm.

The SiC-on-Insulator (SiCOI) film market research report includes in-depth coverage of the industry with estimates & forecasts in terms of revenue (USD Million) from 2021 to 2032, for the following segments

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Market, By Substrate

• Silicon (Si) Substrate
• Silicon Carbide (SiC) Substrate
• Sapphire Substrate
• Other

Market, By Wafer Size

• 100 mm (4-Inch) Wafers
• 150 mm (6-Inch) Wafers
• 200 mm (8-Inch) Wafers
• 300 mm (12-Inch) Wafers

Market, By Technology

• Smart Cut Technology
• Grinding/Polishing/Bonding Technology

Market, By Application

• Power Electronics
• Aerospace and Defense
• Automotive
• Consumer Electronics
• Others

The above information is provided for the following regions and countries

• North America
  • U.S.
  • Canada
• Europe
  • Germany
  • UK
  • France
  • Italy
  • Spain
  • Rest of Europe
• Asia Pacific
  • China
  • India
  • Japan
  • South Korea
  • ANZ
  • Rest of Asia Pacific
• Latin America
  • Brazil
  • Mexico
  • Rest of Latin America
• MEA
  • UAE
  • Saudi Arabia
  • South Africa
  • Rest of MEA