Electronic Adhesives Market - Global Industry Size, Share, Trends, Opportunity, and Forecast, 2017-2027 Segmented By Resin Type (Epoxy, Silicone, Polyurethane, Acrylic, Others), By Form (Liquid, Paste, Solid), By Product Type (Electrically Conductive Adhesives, Thermally Conductive Adhesives, Others), By End User Industry (Consumer Electronics, Medical, Industrial, Transportation, Aerospace & Defe

Published Date: December - 2024 | Publisher: MIR | No of Pages: 320 | Industry: Chemicals | Format: Report available in PDF / Excel Format

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Electronic Adhesives Market - Global Industry Size, Share, Trends, Opportunity, and Forecast, 2017-2027 Segmented By Resin Type (Epoxy, Silicone, Polyurethane, Acrylic, Others), By Form (Liquid, Paste, Solid), By Product Type (Electrically Conductive Adhesives, Thermally Conductive Adhesives, Others), By End User Industry (Consumer Electronics, Medical, Industrial, Transportation, Aerospace & Defe

The global electronic adhesives market is anticipated to observe impressive growth during the forecast period, 2023-2027. The major factors include growing demand for electric component in different industries, and the development in the technologies are supporting the growth of the market. Electronics adhesives are basically a binder which is used to integrate the electronic components due to its high bond strength. They are widely used in industrial, consumer, computers and servers, medical field, and automotive sector. The other factors supporting the market’s growth are, growing electronic industry, rising popularity of medical gadgets and wearables, extensive R&D activities, increasing investments by key market players, and growing demands for electric vehicles. Also, rising adoption of collaborations and product launch are driving the growth of the market.

Rising Demand for Electronic Devices and Equipments

According to the OICA, in 2021, the collective vehicle production across China, Japan, and India was more than 38.5 million. Rising popularity for medical devices and wearables are augmenting the growth of the market

Technological Advancements Supports the Market

For instance, in 2018, a team of professionals at the University of Porto proposed a new polymer coating technique for flexible electronics.


MIR Segment1

Increasing Collaborations and Product Launching

For instance, in 2021, Henkel Adhesive Technologies along with Quad Industries collaborated to provide support for technological value creation, prototyping solutions for printed electronics around multiple end use businesses. Similarly, in 2022, Indium Corporation announced the launch of a new adhesive solution named InTACK at PCIM Europe, which is intended for semiconductor functions.

Market Segmentation

In terms of country, the United States is expected to be a lucrative market in the forecast period due to rising demand in automotive sector in the country.


MIR Regional

Market Players

Henkel AG, 3M Company, Arkema SA, Parker Hannifin Corporation, H.B. Fuller Company, Master Bond Inc., Threebond Co., Ltd., Panacol-Elsol GMBH, Meridian Adhesives Group, and Sika AG

Attribute

Details

Base Year

2021

Historic Data

2017 â€“ 2020

Estimated Year

2022

Forecast Period

2023 – 2027

Quantitative Units

Revenue in USD Million, Volume Units and CAGR for 2017-2021 and 2022-2027

Report coverage

Revenue forecast, Volume forecast company share, competitive landscape, growth factors, and trends

Segments covered

·         Resin Type

·         Form

·         Product Type

·         End User

·         Company

Regional scope

North America; Asia Pacific; Europe & CIS; South America; Middle East & Africa

Country scope

United States; Canada; Mexico; China; India; Japan; South Korea; Germany; France; United Kingdom; Spain; Italy; Brazil; Argentina; Colombia; South Africa; UAE; Saudi Arabia; South Africa;

Key companies profiled

Henkel AG, 3M Company, Arkema SA, Parker Hannifin Corporation, H.B. Fuller Company, Master Bond Inc., Threebond Co., Ltd., Panacol-Elsol GMBH, Meridian Adhesives Group, and Sika AG

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