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Рынок сборки и тестирования аутсорсинговых полупроводников по процессам (распиловка и сортировка), типу упаковки (матрица с шариковой решеткой (BGA) и корпус для масштабирования микросхем), применению (автомобильная, промышленная и телекоммуникационная промышленность) и региону на 2024–2031 гг.

Published on: 2024-08-10 | No of Pages : 240 | Industry : latest trending Report

Publisher : MIR | Format : PDF&Excel

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