Рынок 3D-корпуса полупроводников — глобальный размер отрасли, доля, тенденции, возможности и прогноз, сегментированный по технологии (3D через кремниевые переходные отверстия, 3D-корпус на корпусе, 3D-разветвитель на основе, 3D-корпус с проволочной связью), по материалу (органическая подложка, проволочная проволока, выводная рамка, инкапсуляционная смола, керамический корпус, материал для креплени
Published Date: January - 2025 | Publisher: MIR | No of Pages: 320 | Industry: ICT | Format: Report available in PDF / Excel Format
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