Рынок оборудования для бэкэнд-производства полупроводников — глобальный размер отрасли, доля, тенденции, возможности и прогноз, сегментированный по типу (тестирование пластин, нарезка, склеивание, метрология, сборка и упаковка), по размеру (2D, 2,5D, 3D), по цепочке поставок (производитель интегрированных устройств, аутсорсинг сборки и тестирования полупроводников, литейное производство), региону,
Published Date: January - 2025 | Publisher: MIR | No of Pages: 320 | Industry: ICT | Format: Report available in PDF / Excel Format
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