Рынок корпусов 3D-ИС По технологиям (3D через кремниевые переходные отверстия, 3D корпус в корпусе, 3D на основе разветвления, 3D с проволочной связью), По материалам (органическая подложка, проволочная связь, выводная рамка, инкапсуляционная смола, керамический корпус, материал для крепления кристалла), По отраслевой вертикали (электроника, промышленность, автомобилестроение и транспорт, здравоох
Published Date: January - 2025 | Publisher: MIR | No of Pages: 320 | Industry: ICT | Format: Report available in PDF / Excel Format
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