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구성별 밀폐 포장 시장(다층 세라믹 패키지, 프레스 세라믹 패키지, 금속 캔 포장), 제품(세라믹-금속 밀봉, 유리-금속 밀봉, 부동태화 유리), 애플리케이션(레이저, 포토다이오드, 에어백 인지터, 2024~2031년 MEMS 스위치), 부문(군사 및 국방, 항공우주, 자동차, 의료) 및 지역

Published on: 2024-08-15 | No of Pages : 240 | Industry : latest trending Report

Publisher : MIR | Format : PDF&Excel

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