3D IC 시장 – 글로벌 산업 규모, 점유율, 추세, 기회 및 예측, 유형별(적층 3D 및 모놀리식 3D), 구성 요소별(실리콘 관통 비아(TSV), 유리 관통 비아(TGV), 실리콘 인터포저), 애플리케이션별(논리, 이미징 및 광전자, 메모리, MEMS/센서, LED 및 기타), 최종 사용자별(가전제품, 통신, 자동차, 군사 및 항공우주, 의료 기기, 산업 및 기타), 지역별, 경쟁별, 2018-2028

Published Date: January - 2025 | Publisher: MIR | No of Pages: 320 | Industry: ICT | Format: Report available in PDF / Excel Format

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