인도 LED 패키징 시장, 패키지 유형별(CSP(칩 스케일 패키지), SMD(표면 실장 장치 패키지), COB(칩 온 보드 패키지) 및 기타), 패키징 재료별(리드 프레임, 기판, 세라믹 패키지, 본딩 와이어, 캡슐화 수지 및 기타 패키징 재료), 응용 분야별(일반 조명, 자동차 조명, 백라이트 및 기타 응용 분야), 회사별, 지역별, 예측 및 기회, 2013-2023

Published Date: October - 2024 | Publisher: MIR | No of Pages: 320 | Industry: Consumer Goods and Retail | Format: Report available in PDF / Excel Format

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