半導体市場における仮想製造 - 2017～2027年の世界の業界規模、シェア、傾向、機会、予測、コンポーネント別（ソフトウェアとサービス）、ソフトウェア別（シミュレーション、設計と検証）、サービス別（プロフェッショナル、マネージド）、最終用途別（IDM、ファウンドリ）、製品カテゴリ別（チップ設計と検証、プリント回路基板とマルチチップモジュール、半導体IPとサービス）、地域別
Published Date: January - 2025 | Publisher: MIR | No of Pages: 320 | Industry: ICT | Format: Report available in PDF / Excel Format
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