Mercato PCB ad alta densità di interconnessione: dimensioni, quota, tendenze, opportunità e previsioni del settore globale, segmentato per livelli di interconnessione (1 livello (1+N+1) HDI, 2 o più livelli (2+N+2) HDI e tutti i livelli HDI), per applicazione (elettronica di consumo, automotive, militare e difesa, sanità, industriale/manifatturiero e altri), per regione e concorrenza, 2019-2029F

Published Date: January - 2025 | Publisher: MIR | No of Pages: 320 | Industry: ICT | Format: Report available in PDF / Excel Format

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