Mercato indiano degli imballaggi LED, per tipo di imballaggio (pacchetto Chip Scale (CSP), pacchetto Surface Mount Device (SMD), pacchetto Chip on Board (COB) e altri), per materiale di imballaggio (telai portanti, substrati, pacchetti ceramici, filo di collegamento, resine di incapsulamento e altri materiali di imballaggio), per applicazioni (illuminazione generale, illuminazione per autoveicoli,

Published Date: October - 2024 | Publisher: MIR | No of Pages: 320 | Industry: Consumer Goods and Retail | Format: Report available in PDF / Excel Format

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