Marché des puces retournées – Taille de l’industrie mondiale, part, tendances, opportunités et prévisions, segmenté par processus de bosselage de plaquettes (pilier en cuivre, soudure eutectique étain-plomb, soudure sans plomb et bosselage de goujon en or), par technologie d’emballage (BGA (2.1D/2.5D/3D) et CSP), par produit (mémoire, diode électroluminescente, capteur d’image CMOS, SoC, GPU et CP

Published Date: January - 2025 | Publisher: MIR | No of Pages: 320 | Industry: ICT | Format: Report available in PDF / Excel Format

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