Mercado de empaquetado de semiconductores en 3D: tamaño de la industria global, participación, tendencias, oportunidades y pronóstico, segmentado por tecnologÃa (3D a través de silicio, 3D paquete sobre paquete, 3D basado en abanico, 3D unido por cable), por material (sustrato orgánico, cable de unión, marco conductor, resina de encapsulación, paquete de cerámica, material de unión de matriz), por
Published Date: January - 2025 | Publisher: MIR | No of Pages: 320 | Industry: ICT | Format: Report available in PDF / Excel Format
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