2024 年至 2031 年半导体（硅）知识产权市场按设计 IP（接口 IP、内存 IP、处理器 IP）、按 IP 来源（许可、版税）、按最终用户（消费电子、汽车、工业、电信、航空航天和国防）和地区划分
Published Date: September - 2024 | Publisher: MIR | No of Pages: 240 | Industry: latest trending Report | Format: Report available in PDF / Excel Format
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