半导体封装市场 – 全球行业规模、份额、趋势、机遇和预测。半导体封装市场规模 – 按封装平台（先进封装、传统封装）、按类型（倒装芯片、嵌入式 DIE、扇入 WLP、扇出 WLP）、按技术（网格阵列、小外形封装、扁平无引线封装、双扁平无引线 (DFN)、四扁平无引线 (QFN)、双列直插式封装、塑料双列直插式封装 (PDIP)、陶瓷双列直插式封装 (CDIP)、其他）、按最终用户行业（消费电子、航空航天和国防、医疗设备、通信和电信、汽车、能源和照明）、按地区、按公司和按地区、预测和机遇，2018-2028 年
Published Date: January - 2025 | Publisher: MIR | No of Pages: 320 | Industry: ICT | Format: Report available in PDF / Excel Format
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