美国半导体市场按组件（存储器件、逻辑器件、模拟 IC、MPU、MCU、传感器、分立功率器件等）、按节点大小（28nm、40nm、65nm、90nm、120nm、130nm）、按应用（IT 和电信、国防和军事、工业、消费电子、汽车、其他）、按类型（本征半导体和非本征半导体）、按材料类型（硅、锗和砷化镓）、按地区、竞争预测和机遇 2018-2028
Published Date: January - 2025 | Publisher: MIR | No of Pages: 320 | Industry: ICT | Format: Report available in PDF / Excel Format
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