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2024 年至 2031 年半导体（硅）知识产权市场按设计 IP（接口 IP、内存 IP、处理器 IP）、按 IP 来源（许可、版税）、按最终用户（消费电子、汽车、工业、电信、航空航天和国防）和地区划分

Published on: 2024-09-19 | No of Pages : 240 | Industry : latest trending Report

Publisher : MIR | Format : PDF&Excel

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