3D IC 封装市场按技术（3D 硅通孔、3D 堆叠封装、3D 扇出型封装、3D 引线键合）、按材料（有机基板、键合线、引线框架、封装树脂、陶瓷封装、芯片粘接材料）、按垂直行业（电子、工业、汽车与运输、医疗保健、IT 与电信、航空航天与国防）、按地区、按竞争预测与机遇划分，2018 年至 2028 年预测
Published Date: January - 2025 | Publisher: MIR | No of Pages: 320 | Industry: ICT | Format: Report available in PDF / Excel Format
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